Qualcomm Technologies

New Delhi, India – HFCL Limited, the high-tech enterprise and integrated communication product and solution provider in collaboration with Qualcomm Technologies, Inc. launches open source Wi-Fi 7 access points under its IO product line at India Mobile Congress, pragati maidan, New Delhi on 01 October 2022.

Washington, United States. 08 August, 2022 – Following the recent passage of the U.S. Chips and Science Act last week, GlobalFoundries, a global provider in feature-rich semiconductor manufacturing and Qualcomm Technologies, Inc. announced they are more than doubling their existing strategic global long-term semiconductor manufacturing agreement previously entered into by GF’s and Qualcomm’s respective subsidiaries. The announcement secures wafer supply

Shenzhen, China. 20 July, 2022 – Fibocom, a global provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announced the launch of AI smart module SCA825-W. Powered by Qualcomm Technologies‘ premium-tier SoC (System-on-Chip) QCS8250, the module is designed to meet the requirements of high-end AIoT scenarios such as HD video conferences, HD livestreaming, cloud gaming,

Qualcomm Technologies, Inc. has unveiled the latest additions to the company’s suite of premium wearable platforms, Snapdragon W5+ Gen 1 and Snapdragon W5 Gen 1. These platforms are designed to advance ultra-low power and breakthrough performance for connected wearables with a focus on extended battery life, premium user experiences, and sleek, innovative designs. By using

Ericsson, Thales, a global specialist in aerospace, defence, security & digital identity, and wireless technology provider Qualcomm Technologies, Inc. are planning to take 5G out of this world and across a network of Earth-orbiting satellites.

London, UK. 27 June 2022 – Qualcomm Technologies, Inc. has launched new RF Front-End (RFFE) modules targeted for Wi-Fi and Bluetooth experiences. The expanded portfolio is designed for Bluetooth, Wi-Fi 6E, and the standard, Wi-Fi 7. The modules are designed for a wide array of device segments beyond smartphones including automotive, XR, PCs, wearables, mobile

Qualcomm Technologies, Inc. has announced Qualcomm AI Stack portfolio, accelerating the company’s leadership in artificial intelligence (AI) and the Connected Intelligent Edge. Combining and improving its AI software offerings, Qualcomm AI Stack is a comprehensive AI solution for OEMs and developers, supporting a wide range of intelligent devices with broad AI software access and compatibility.

Raleigh, North Carolina, USA. (BUSINESS WIRE) –Telit Wireless Solutions, a global vendor of M2M modules and value-added services, has introduced the UE910 V2 HSDPA and HE910 V2 HSPA+ modules based on Qualcomm Technologies, Inc. chipsets